Fast-Drying Electronic Component Adhesive with UV Curing Technology
AG50820 is a solvent-free, single-component UV/humidity dual-curing adhesive with excellent extrusibility and molding properties. It delivers superior curing strength, adhesive performance, and moisture resistance, ensuring high reliability. The adhesive features a fluorescent UV indicator for easy detection of adhesive leakage or insufficient application. Ideal for three-proof protection of printed circuit boards and components, it also enhances the vibration and impact resistance of printed circuit board reinforcement and bonding operations across various materials.

1.Equipped with a fluorescent ultraviolet indicator for easy inspection.
2.UV / moisture curing.
3.It exhibits excellent adhesion to various substrates, including glass, metal, PCB, and PC.
4.The coating has high moisture resistance and good reliability.
5.100% solid content, compliant with environmental standards including RoHS, HF, and REACH.
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80±2 |
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40 |
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5.5 |
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>6 |
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<0.3 |
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32 |
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>1.0*1014 |
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>1.0*1013 |
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